The invention discloses a small outline integrated circuit packaging device; the structure comprises a substrate inlet, a packaging control box, a convey belt fixed plate, a conveyer belt, radiating holes, a protection pedestal, a cable wire, and a control button; the packaging control box comprises elevation packaging mechanisms, a power device, a control room, a trigger mechanism, a transmissionmechanism, a lever structure, a first transmission mechanism, a second transmission mechanism, a rotary motor, a driver belt, an energy supply motor and a packaging fixed device. The packaging fixeddevice is arranged in the control room; when a to-be-packaged chip is conveyed to the position via the conveyer belt, the chip weights and triggers chip induction seats; the two chip induction seats are matched with the elevation packaging mechanisms one by one; only when the to-be-packaged chip is conveyed to the chip induction seats, the packaging work can be started, thus preventing packaging offset; the dual packaging mechanisms and chip induction seats can effectively improve the packaging efficiency, and can reduce the defective product forming rates.