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发明授权
CN108291307B 用于钯的化学浸镀的镀浴组合物及方法 有权

用于钯的化学浸镀的镀浴组合物及方法
摘要：
本发明涉及用于通过化学浸镀将钯层沉积到基板上的水性镀浴组合物和方法。根据本发明的水性镀浴组合物包含钯离子的源、钯离子的还原剂和不饱和化合物。根据本发明的水性镀浴组合物在将钯的沉积速率保持在期望的满意值的同时，由于所述不饱和化合物而相对于不希望的分解具有改善的稳定性。所述水性镀浴组合物也具有延长的使用寿命。本发明的不饱和化合物使得能够在所述浴的使用寿命期间将沉积速率调节至满意范围并且使得能够在较低温度下化学沉积钯层。
摘要（英）：

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

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