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发明公开
CN108156746A 多层电路板及其制造方法 无效 - 驳回

多层电路板及其制造方法
摘要：
本发明涉及一种多层电路板及其制造方法，所述多层电路板包括多个绝缘凸块、第一导体层、第二导体层。多个绝缘凸块设置于第一基板与第二基板之间，多个绝缘凸块的顶部作为电路连接点。第一导体层设置于第一基板上，且连接至电路连接点。第二导体层设置于第二基板上，且连接至电路连接点。本申请多层电路板可视使用需求而简易地变更电路布局，在使用上极具弹性。
摘要（英）：

A multi-layer circuit board including a plurality of insulation bumps, a first conductive layer, and a second conductive layer is provided. The plurality of insulation bumps are disposed between a first substrate and a second substrate. A top portion of the plurality of insulation bumps is served as a circuit connection point. The first conductive layer is disposed on the first substrate and connected to the circuit connection point. The second conductive layer is disposed on the second substrate and connected to the circuit connection point.

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