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发明授权
CN107833838B 一种气密性器件的高可靠性封装结构及其制造方法 有权

一种气密性器件的高可靠性封装结构及其制造方法
摘要：
本发明公开了一种气密性器件的高可靠性封装结构，包括：气密性封装管壳，所述气密性封装管壳包括空腔、环绕侧墙和底面；设置在所述气密性封装管壳的空腔内的芯片；将所述芯片焊盘电连接至所述气密性封装管壳底面管脚的导电焊线；覆盖于所述导电焊线表面的绝缘涂层，以及设置在所述气密性封装管壳环绕侧墙上的气密性盖板。
摘要（英）：

The invention discloses a high-reliability package structure for an airtight device, comprising: a hermetically sealed package shell which comprises a cavity, a surrounding sidewall and a bottom surface; a chip which is arranged in the cavity of the hermetically sealed package shell; a conductive bonding wire on the bottom of the hermetically sealed package shell and electrically connected to a chip pad; an insulating coating that covers the surface of the conductive bonding wire, and an airtight cover plate which is provided on the surrounding side wall of the hermetically sealed package shell.

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