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发明公开
CN107785289A 基板处理方法、基板处理装置以及记录介质 审中-实审

基板处理方法、基板处理装置以及记录介质
摘要：
本发明涉及基板处理方法、基板处理装置以及记录介质，有效提高涂布膜的膜厚的均匀性。涂布和显影装置(2)具备：喷嘴(22)，其向晶圆喷出处理液；压送部(40)，其向喷嘴侧加压输送处理液；送液管路(50)，其具有从压送部侧向喷嘴侧排列的阀(53、54)，用于从压送部向喷嘴引导处理液；以及控制器(100)。控制器构成为执行以下动作：在阀(54)关闭且阀(53)与阀(54)之间的压力比压送部与阀(53)之间的压力高的状态下打开阀(53)；控制压送部以使由于阀(53)打开而降低的阀(53)与阀(54)之间的压力上升；以及在由于阀(53)打开而阀(53)与阀(54)之间的压力降低之后打开阀(54)。
摘要（英）：

The invention relates to a substrate processing apparatus, a substrate processing method, and a storage medium which are effective for improving the uniformity of a film thickness of a coating film. Acoating and developing apparatus (2) according to the present disclosure includes: a nozzle (22) that ejects a processing liquid to a wafer; a force-feeding unit (40) that force-feeds the processingliquid to the nozzle side; a liquid feeding pipeline (50) that includes first and second valves (53, 54) and guides the processing liquid from the force-feeding unit to the nozzle; and a controller (100). The controller is configured to perform opening the first valve (53) in a state where the second valve (54) is closed and a pressure between the first and second valves (53, 54) is higher than apressure between the force-feeding unit and the first valve (53), controlling the force-feeding unit to increase the pressure between the first and second valves (53, 54) that has been decreased by the opening of the first valve (53), and opening the second valve (54) after the pressure between the first and second valves (53, 54) is decreased by the opening of the first valve (53).

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