The invention relates to a method for improving drop of tube cores in a GaAs-based LED chip cutting process. The method comprises the steps of: (a), semi-cutting the surface of an LED chip by utilizing a saw blade; (b), baking the semi-cut LED chip; (c), performing blue film lamination of the baked LED chip; (d), performing secondary baking of the blue film laminated LED chip; (e), fully cutting the secondarily baked LED chip; and (f), performing film expansion after cleaning the fully cut LED chip. With the help of a heater, the chip is baked before being laminated; the stress of the chip itself can be effectively released; the deformation tension of the chip itself can be reduced; simultaneously, the laminated chip together with a blue film is baked; therefore, the malleability of the blue film is improved; therefore, the film is thoroughly expanded; the viscidity of the blue film is improved; the method for effectively improving drop of the tube cores in the GaAs-based LED chip cutting process is simple to work and high in effectiveness; the drop problem of the tube cores can be effectively solved; and thus, the product throughput can be increased.