The present invention relates to a surface-treated copper foil for a PCB having a fine-circuit pattern and a method of manufacturing the same. The method of manufacturing the surface-treated copper foil for the PCB having the fine-circuit pattern according to the present invention includes a first step of disposing a copper foil as an anode in a plating solution including one or more metallic ions of Co, Ni, Mo, W, Cu, and Fe and forming a metal alloy layer by electrolysis, a second step of forming a roughened layer with a protrusion by roughening the formed metal alloy layer, a third step of forming a Zn coating layer on the roughened layer, a fourth step of forming an electrolytic chromate layer on the coating layer, and a fifth step of forming a silane coupling agent-treated layer on the electrolytic chromate layer. According to the present invention, the copper foil is surface-treated by forming the metal alloy layer to improve peel strength of the copper foil.