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发明公开
CN106941095A 用于分离多个芯片的方法 无效 - 撤回

用于分离多个芯片的方法
摘要：
本发明涉及用于分离多个芯片的方法，其中，芯片可以具有衬底；布置在衬底中和/或衬底上的有源区，在该有源区中构成有至少一个电子部件；和在有源区上面的电介质。用于分离多个芯片的方法具有在多个芯片之间构成至少一个第一沟道的步骤，其中，至少一个第一沟道穿过电介质和有源区地构成并且延伸到衬底中。所述方法还具有从与第一沟道对置的衬底侧来锯切衬底材料的步骤。锯切可沿锯切路径来进行，该锯切路径相应于至少一个第一沟道的走向，使得构成至少一个第二沟道。所述至少一个第一沟道的宽度小于或等于所述至少一个第二沟道的宽度。
摘要（英）：

A method for singulating a multiplicity of chips is provided. Each chip includes a substrate, an active region arranged at least one of in or on the substrate, at least one electronic component being formed in said active region, and a dielectric above the active region. The method includes forming at least one first trench between the chips. The at least one first trench is formed through the dielectric and the active regions and extends into the substrate. The method further includes sawing the substrate material from the opposite side of the substrate relative to the first trench along a sawing path corresponding to the course of at least one first trench, such that at least one second trench is formed. The width of the at least one first trench is less than or equal to the width of the at least one second trench.

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