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发明公开
CN106486450A 球焊用钯被覆铜线 有权

球焊用钯被覆铜线
摘要：
本发明提供了一种球焊用钯(Pd)被覆铜线，其用以解决“CuAl的金属间化合物在初期形成于量产的接合线的FAB所形成的熔融焊球与铝垫的接合界面”这样的课题，并且可使钯(Pd)微粒子均匀分散于熔融焊球的表面，而适用于量产化。本发明的球焊用钯(Pd)被覆铜线，其为线径在10～25μm的球焊用钯(Pd)被覆铜线，于纯铜(Cu)或铜(Cu)纯度为98质量％以上的铜合金所构成的芯材上形成有钯(Pd)延伸层，其中该钯(Pd)延伸层为含有硫(S)、磷(P)、硼(B)或碳(C)的钯(Pd)层。
摘要（英）：

The invention provides a palladium (Pd)-coated copper wire, in order to solve the problem that Cu-Al intermetalic compun compound is primarily formed at an interface between molten ball formed by FAB of bonding wires and an aluminum pad in mass production. The palladium (Pd)-coated copper wire for ball bonding has a diameter of 10 to 25 [mu]m, a palladium (Pd) drawn layer is formed on a core formed of a copper alloy in which the purity of pure copper (Cu) or copper (Cu) is 98% by mass or more and the palladium (Pd) drawn layer is a palladium (Pd) layer which contains sulfur (S), phosphorus (P), boron (B) or carbon (C).

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