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发明公开
CN106463415A 接合体的制造方法 有权

接合体的制造方法
摘要：
一种制造具有通过金属粒子浆将基板与电子部件接合的构造的接合体的接合体的制造方法，包括：组合体形成工序，形成将电子部件通过所述金属粒子浆载置在基板上的组合体；组合体配置工序，在互相相对配置的两片加热板之间配置组合体；以及接合工序，通过使两片加热板中的至少一片朝另一片移动，从而对组合体加压并加热后将基板与电子部件接合，其中，以通过两片加热板开始对组合体加压时的组合体的温度在0℃～150℃的范围内为条件实施接合工序。根据本发明的接合体的制造方法，由于是以加压开始时的组合体的温度在0℃～150℃的范围内为条件来实施接合工序的，因此在接合工序中，在对组合体进行加压前金属粒子浆就不易引发烧结反应，其结果就是，能够以比以往更高的接合力将基板与电子部件接合。
摘要（英）：

Disclosed is a bonded body production method for producing a bonded body having a structure in which a substrate and an electronic component are bonded by means of a metal particle paste, the method comprising: an assembly forming step for forming an assembly in which an electronic component is placed on a substrate with a metal particle paste therebetween; an assembly arranging step for arranging the assembly between two heating plates; and a bonding step for bonding the substrate and the electronic component together by heating the assembly while pressurizing the same by moving at least one of the two heating plates toward the other. In this bonded body production method, the bonding step is performed under a condition where the temperature of the assembly at the time of starting the pressurization of the assembly with the two heating plates is within the range of from 0 DEG C to 150 DEG C. According to this bonded body production method, because the bonding step is performed under a condition where the temperature of the assembly at the time of starting pressurization is within the range of from 0 DEG C to 150 DEG C, the metal particle paste is less likely to undergo a sintering reaction before pressurizing the assembly in the bonding step, and as a result, the substrate and the electronic component can be bonded together with higher bonding force than before.

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