The invention provides a chip packaging module which comprises a to-be-packaged chip, a magnetic conductive intermediate layer and a packaging substrate, wherein an integrated magnetic device is arranged on the to-be-packaged chip; the magnetic conductive intermediate layer is fixedly connected between the to-be-packaged chip and the packaging substrate. Due to the magnetic conductive intermediate layer, a magnetic field generated by the integrated magnetic device can be guided to the edge, so that the magnetic field entering the packaging substrate can be reduced, eddy current generated by the magnetic field in the packaging substrate can be further reduced, and the performance of the to-be-packaged chip is improved.