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发明授权
CN106449550B 芯片封装模块 有权 转让

芯片封装模块
摘要：
本发明提供的芯片封装模块包括：待封装芯片、导磁性中间层以及封装基板，所述待封装芯片设置有集成磁性器件，所述导磁性中间层固定连接于所述待封装芯片与所述封装基板之间。由于导磁性中间层可以将集成磁性器件产生的磁场向边缘引导，从而可以减少进入封装基板中的磁场，进而可以减小磁场在封装基板中产生的涡流，提高上述待封装芯片的性能。
摘要（英）：

The invention provides a chip packaging module which comprises a to-be-packaged chip, a magnetic conductive intermediate layer and a packaging substrate, wherein an integrated magnetic device is arranged on the to-be-packaged chip; the magnetic conductive intermediate layer is fixedly connected between the to-be-packaged chip and the packaging substrate. Due to the magnetic conductive intermediate layer, a magnetic field generated by the integrated magnetic device can be guided to the edge, so that the magnetic field entering the packaging substrate can be reduced, eddy current generated by the magnetic field in the packaging substrate can be further reduced, and the performance of the to-be-packaged chip is improved.

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