The invention discloses an Au-In isothermal solidification-based low-temperature bonding method, which comprises the steps of forming a first gold pattern layer on a bonding surface of a first substrate; forming a convex point pattern layer on a bonding surface of a second substrate; sequentially forming a second gold pattern layer and an indium pattern layer covering the convex point pattern layer on the bonding surface of the second substrate; and aligning and fixing the bonding surface of the first substrate and the bonding surface of the second substrate to carry out bonding. According to the method, the convex point pattern layer is added to a metal thin film bottom layer, so that the bonding alignment accuracy is reduced by the convex point pattern layer, meanwhile, the contact force in the bonding process is also strengthened, and the bonding quality can be greatly improved.