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发明公开
CN105873716A Cu芯球、焊膏、成形焊料、Cu芯柱和钎焊接头 有权

Cu芯球、焊膏、成形焊料、Cu芯柱和钎焊接头
摘要：
本发明提供能得到落下强度和针对热循环的强度的Cu芯球、Cu芯柱。Cu芯球(1)具备：由Cu或Cu合金构成的Cu球(2)；和由含有Sn和Cu的软钎料合金构成且覆盖Cu球(2)的焊料层(3)，焊料层(3)含有0.1％以上且3.0％以下的Cu，余量由Sn和杂质构成。
摘要（英）：

Provided are a Cu core ball and a Cu core column making it possible to obtain drop strength and strength in relation to heat cycle. The Cu core ball (1) is provided with: a Cu ball (2) configured from Cu or a Cu alloy; and a solder layer (3) configured from a solder alloy comprising Sn and Cu, the solder layer (3) covering the Cu ball (2). The solder layer (3) contains 0.1-3.0% Cu, the balance being Sn and unavoidable impurities.

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