The invention provides an area array pin-less CSP packaging member and a manufacturing method thereof. The area array pin-less CSP packaging member comprises multiple disconnected lead-out ends of which the upper and lower surfaces are provided with a nickel layer. A resin layer is superposed on the nickel layer and fills upper end cavities between the adjacent lead-out ends. The resin layer is provided with multiple copper plated through holes which are communicated with the nickel layer. The copper plated through holes are communicated through printed lines, and IC chips are adhered. A packaging body is arranged on the resin layer. A copper alloy thin sheet plated with the nickel layer is etched. The resin layer is superposed on the copper alloy thin sheet. Multiple copper plated through holes communicated with the nickel layer and multiple printed lines are manufactured on the resin layer. The IC chips are adhered on the resin layer so that the CSP packaging member is manufactured through plastic packaging. According to the CSP packaging member, the resin layer acts as an intermediate supporting layer, rewiring of a packaging circuit is realized by the printed lines, and the lead-out ends of the packaging device are distributed at the bottom part of the packaging body in an area array so that the packaging member is enabled to accommodate more lead-out terminals within unit installation area.