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发明公开
CN105789071A 一种用于微波芯片共晶加压的装置及加压方法 无效 - 驳回

一种用于微波芯片共晶加压的装置及加压方法
摘要：
本发明涉及微波芯片共晶技术，本发明公开了一种用于微波芯片共晶加压的装置，具体包括基板限位器、芯片限位器和点接触压块，芯片限位器上设置芯片限位孔，所述芯片限位孔的尺寸与芯片的尺寸相匹配，用作芯片的限位；芯片的下表面通过焊片与基板的上表面相接触；所述点接触压块的底板上设置微支撑柱，微支撑柱的数量小于或者等于芯片上表面的焊盘数量，微支撑柱的位置与芯片上表面的焊盘位置镜像对称，点接触压块上的微支撑柱与芯片上表面的焊盘相接触。芯片与基板共晶时，点接触压块上只有微支撑柱与芯片表面的焊盘相接触，避免了微波芯片表面“空气桥”等特殊结构的损伤。本发明还公开了一种微波芯片共晶加压方法。
摘要（英）：

The invention relates to the microwave chip eutectic technology and discloses a device used for realizing microwave chip eutectic pressurization. The device specifically comprises a substrate limiter, a chip limiter and a point contact press block, wherein the chip limiter is provided with a chip limit hole, the dimension of the chip limit hole is in matching with the dimension of a chip and is used for limiting the chip, the lower surface of the chip contacts with an upper surface of a substrate through a welding tab, the bottom board of the point contact press block is provided with micro supporting columns, the quantity of the micro supporting columns is smaller than or equal to the quantity of welding pads on the upper surface of the chip, positions of the micro supporting columns and positions of the welding pads on the upper surface of the chip are in mirror symmetric relationship, and the micro supporting columns on the point contact press block contact with the welding pads on the upper surface of the chip. When the chip and the substrate are in an eutectic state, on the point contact press block, only the micro supporting columns and the welding pads on the surface of the chip mutually contact, so a special structure such as an air bridge on the surface of the microwave chip can be prevented from being damaged. The invention further discloses a microwave chip eutectic pressurization method.

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