The invention provides a wafer center positioning device. The wafer center positioning device includes: a horizontally arranged central disk; a wafer bearing table used for placing a wafer, the wafer bearing table being arranged parallel to the central disc and located above the central disc, and a lower surface and a central position of the wafer bearing table being provided with a vertical first driving shaft; a plurality of eccentric discs arranged parallel to the central disc, located above the central disc and uniformly distributed in the periphery of the wafer bearing table, an edge of each eccentric disc being provided with a vertical eccentric finger, and a lower surface of each eccentric disc being provided with a vertical second driving shaft; a first driving mechanism connected with the first driving shaft; and a second driving mechanism connected with a second driving shaft of each eccentric disc. The wafer center positioning device solves the problems that an existing device for positioning of a wafer center is complicated in structure and inconvenient to operate.