The invention relates to an electronic apparatus and a method for manufacturing a semiconductor device. The electronic apparatus includes: a first semiconductor chip and a second semiconductor chip each includes a semiconductor substrate and a wiring layer. Opposite surfaces of a first insulating layer of the first semiconductor chip and a second insulating layer of the second semiconductor chip are bonded to each other, the first wiring part of the first semiconductor chip and the second wiring part of the second semiconductor chip are not exposed from the opposite surfaces of the first insulating layer and the second insulating layer, and the first wiring part and the second wiring part are electrically connected to each other through conductive parts in peripheral areas of the first semiconductor chip and the second semiconductor chip. According to the electronic apparatus provided by the invention, the manufacturing efficiency of the apparatus can be improved, the cost can be reduced, the reliability of the apparatus can be improved and the apparatus can be miniaturized.