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发明授权
CN105552201B 一种LED封装用固晶材料及其制备方法 失效 - 权利终止

一种LED封装用固晶材料及其制备方法
摘要：
本发明公开了一种LED封装用固晶材料及其制备方法，该固晶材料包括锡基焊粉、高导热率颗粒和固晶助焊膏，其中高导热率颗粒选自金刚石颗粒、纳米碳管和SiC中的一种或两种以上；高导热率颗粒的体积分数占锡基焊粉和高导热率颗粒总体积的0.1%‑70%。本发明的固晶材料含有高导热率颗粒，能够在满足LED芯片与热沉的粘结强度以及不影响电性能的前提下，获得高导热率，其导热率是现有LED固晶焊料导热率的几倍甚至几十倍。采用本发明的固晶材料，可以有效降低功率LED器件热阻，提高LED芯片散热能力，降低LED芯片结温，提高LED器件及应用产品的寿命。
摘要（英）：

The invention discloses a die bonding material for LED encapsulation and a preparation method thereof. The die bonding material comprises tin-based soldering powder, high-thermal-conductivity particles and die-bonding solder paste, wherein the high-thermal-conductivity particles include one or two substances selected from diamond particles, carbon nanotubes and SiC, and the volume of the high-thermal-conductivity particles accounts for 0.1-70% of the total volume of the tin-based soldering powder and the high-thermal-conductivity particles. As the die bonding material of the invention contains the high-thermal-conductivity particles, high thermal conductivity can be achieved on the premise of meeting the bonding strength between an LED chip and a heat sink and not affecting the electrical performance, and the thermal conductivity is several times or even dozens of times that of the existing LED die bonding solder. By adopting the die bonding material of the invention, the thermal resistance of power LED devices is reduced effectively, the heat dissipation capacity of LED chips is improved, the junction temperature of LED chips is reduced, and the service life of LED devices and application products is increased.

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