A heat shield film (100) that is formed on a wall surface of an aluminum-based member (W) includes: a matrix layer (10) diffusion-bonded to the wall surface (diffusion bonding layer (10′)), having a coefficient of linear expansion of 15×10−6/K to 25×10−6/K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles (20) dispersed in the matrix layer (10).