The invention relates to a method for permanently bonding a wafer, and particularly discloses a method for bonding a first contact surface (3) of a first substrate (1) to a second contact surface (4) of a second substrate (2). The method comprises the following steps, especially in the following order: forming a reservoir (5) in a surface layer (6) on the first contact surface (3); at least partially filling the reservoir (5) with a first starting materials or a first group of starting materials; enabling the first contact surface (3) to contact the second contact surface (4) to form a pre-bonding connection; and forming a permanent bonding between the first contact surface (3) and the contact surface (4), and at least partially strengthening the permanent bonding through a reaction of the first starting materials and second starting materials contained in a reaction layer (7) of the second substrate.