The invention discloses an ejector pin elevating mechanism used for vacuum plating equipment, which relates to the technical field of vacuum plating, and problem that an ejector pin elevating mechanism is assembled on the vacuum plating equipment and the assembling efficiency is low can be solved. The ejector pin elevating mechanism comprises three ejector pin members corresponding to three preformed holes on a support bench in a vacuum cavity, each ejector pin member comprises a linear bearing fixedly arranged in the preformed hole, the ejector pins which are inserted into the preformed holes and a bearing aperture of the linear bearing, a spacing cap arranged at upper end of the ejector pin and capable of passing through the preformed hole and avoiding shedding of the ejector pin from the bearing aperture; a supporting plate positioned at lower part of the support bench and used for supporting three ejector pins; and a driving unit positioned outside the vacuum cavity, connected with the supporting plate and used for driving elevation of the supporting plate. The provided ejector pin elevating mechanism is used for taking and putting a substrate when vacuum plating is carried out.