The invention discloses a method for no-glass-cloth ceramic high-frequency PCB plate edge metallization. The method comprises steps: board cutting, drilling, groove milling, plasma processing, copper deposition, board plating, patterning, pattern electroplating, etching, solder resisting, gold deposition, board milling and the like. Through the method, plate edge metallization can be achieved, the problem of electrostatic discharge protection is solved effectively, and the breaking problem of a ceramic high-frequency PCB during the manufacturing process can be solved effectively.