The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer (6) having a sandwich structure comprising a bottom layer (7), a top layer (8) and a insulating layer(9) located between said bottom and top layers (7, 8), (b) etching away the top layer (8) to delineate lateral walls (12) of bodies (11) of the microcarriers, (c) depositing a first active layer (13)at least on a top surface (14) of the bodies (11), (d) applying a continuous polymer layer (16) over the first active layer(13), (e) etching away the bottom layer (7) and the insulating layer (9), (f) removing the polymer layer (16) to release the microcarriers.