The invention discloses a high-activity chemical copper plating solution and a chemical copper plating method. The high-activity chemical copper plating solution is characterized by mainly consisting of copper salt, a reducing agent, a complexant, a pH regulator and a combined additive, wherein the complexant is one or combination of several of ethylenediamine tetraacetic acid, sodium potassium tartrate, sodium citrate, N-(2-hydroxyethyl)ethylenediaminetriacetic acid, tetrahydroxypropyl ethylenediamine, triethanolamine and nitrilotriacetic acid; the combined additive is combination of N and/or S-containing additives. The high-activity chemical copper plating solution has the advantages of being high plating solution activity, low in operation temperature, good in stability and particularly suitable for the chemical copper plating of surfaces of nonmetal matrixes which are relatively weak in activation degree.