The invention provides a plated copper wire structure used for ultrasonic bonding, through which even if plating materials of plated copper wires or core material types and wire diameters are changed , ultrasonic bonding can be stably carried out with a broad process window when a bonding condition is not individually set. The structural characteristics of the plated copper wire structure used for the ultrasonic bonding are that the surface morphology is that a plurality of cirrus-cloud-shaped grooves along length direction of a bonding wire are molded in the surface of the core materials; the core materials are plated with plating materials composed of precious metal or alloy (which is briefly referred to as precious metal, etc. ) which are with better inoxidizability than the inoxidizability of the core materials.