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CN104143545A 封装布局和形成封装布局的方法 失效 - 放弃专利权

封装布局和形成封装布局的方法
摘要：
在各种实施例中，可以提供封装布局。封装布局可以包括至少一个芯片。封装布局可以进一步包括至少部分地包封芯片的包封材料。封装布局也可以包括在芯片的第一侧之上的重分布结构。封装布局可以进一步包括在芯片的第二侧之上的金属结构。第二侧可以与第一侧相对。封装布局可以附加地包括电耦合到重分布结构和金属结构的半导体结构和导电塑性材料结构中的至少一个，以在重分布结构和金属结构之间形成电流路径。
摘要（英）：

In various embodiments, a package arrangement may be provided. The package arrangement may include at least one chip. The package arrangement may further include encapsulation material at least partially encapsulating the chip. The package arrangement may also include a redistribution structure over a first side of the chip. The package arrangement may further include a metal structure over a second side of the chip. The second side may be opposite the first side. The package arrangement may additionally include at least one of a semiconductor structure and an electrically conductive plastic material structure electrically coupled to the redistribution structure and the metal structure to form a current path between the redistribution structure and the metal structure.

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