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发明公开
CN104094392A 用于将材料沉积于基板上的方法 无效 - 撤回

用于将材料沉积于基板上的方法
摘要：
本发明公开了一种通过材料沉积系统将材料沉积在电子基板上的方法。该沉积系统包括框架、连接至框架的机架系统、连接至机架系统并且配置成在电子基板上沉积粘性与半粘性材料的点的沉积头、配置成控制材料沉积系统的操作包括机架系统与沉积头的操作的控制器。该方法包括通过沿基本上不平行于材料的线路或图案的方向的移动轴移动所述沉积头而在电子基板上沉积材料的线路或图案。进一步公开了其他方法与沉积系统。
摘要（英）：

A method of depositing materials on an electronic substrate with a material deposition system is disclosed. The deposition system includes a frame, a gantry system coupled to the frame, a deposition head coupled to the gantry system and configured to deposit dots of low viscous and semi-viscous material on the electronic substrate, and a controller configured to control the operation of the material deposition system, including the operation of the gantry system and the deposition head. The method includes depositing a line or a pattern of material on the electronic substrate by moving the deposition head along an axis of motion that is substantially non-parallel to a direction of the line or pattern. Other methods and deposition systems are further disclosed.

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