The invention relates to a novel high-density stackable packaging structure and a manufacturing method thereof. The packaging structure comprises a metal lead frame and a substrate (5). A chip (3) is stuck to the front face of the metal lead frame or the substrate (5). Copper columns (2) are arranged on the periphery of the chip (3), tin columns (4) are arranged on the tops of the copper columns (2), the peripheries of the copper columns (2), the chip (3) and the tin columns (4) are coated with molding compounds (1) which are higher than the tin columns (4), and installation holes (6) are formed in the tops of the tin columns (4). The novel light-density stackable packaging structure and the manufacturing method of the novel high-density stackable packaging structure have the advantages that substrate design and manufacturing precision is improved in an electroplating and laser drilling combined mode, fine pitch packaging body stacking can be achieved, and packaging body safety and reliability are improved.