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发明授权
CN104037143B 具有与接触焊盘相重叠的嵌入式金属迹线的衬底的封装件 有权

具有与接触焊盘相重叠的嵌入式金属迹线的衬底的封装件
摘要：
本发明公开了一种封装件以及制造封装件的方法。实施例封装件包括支撑导电柱的集成电路，具有在每个嵌入式金属迹线上的接触焊盘的衬底，接触焊盘宽度大于相应的嵌入式金属迹线宽度，以及将导电柱电连接至接触焊盘的导电材料。在实施例中，接触焊盘与金属迹线在一个方向上相重叠。本发明还公开了具有与接触焊盘重叠的嵌入式金属迹线的衬底的封装件。
摘要（英）：

A package and method of making the package are provided. An embodiment package includes an integrated circuit supporting a conductive pillar, a substrate having a landing pad on each embedded metal trace, a landing pad width greater than a corresponding embedded metal trace width, and a conductive material electrically coupling the conductive pillar to the landing pad. In an embodiment, the landing pad overlaps the metal trace in one direction.

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