An electric current lead connecting a superconductivity device provided in a low-temperature section and an external device provided in a normal-temperature section, and comprising: a low temperature-side electrode connected to the superconductivity device; a normal temperature-side electrode connected to the external device; and a Peltier element having the low temperature-side electrode bonded to one surface thereof and the normal temperature-side electrode bonded to the other surface thereof. A nickel-plated layer having a thickness of 5-40 [mu]m is formed on the surfaces of the Peltier element that bond to the low temperature-side and normal temperature-side electrodes; silver-plated layers having a thickness of 5-40 [mu]m are formed on the surfaces of the low temperature-side electrode and normal temperature-side electrode that bond to the Peltier element; the Peltier element, the low temperature-side electrode, and the normal temperature-side electrode are arranged such that the nickel-plated layer and the silver-plated layers are facing; and these comprise a solder-bonded structure.