The invention discloses a manufacturing method of a circuit board for bearing large current. The method comprises the steps that a first hollow-out groove penetrating through a first laminated plate is formed on the first laminated plate; a prepreg layer which is arranged on a second laminated plate is provided, a containing groove is formed in the prepreg layer, a conducting block is embedded into the containing groove, and the conducting block is provided with a first protruding part which protrudes out of an upper end groove opening in the upper end of the containing groove upwards; the first laminated plate is placed on the prepreg layer, so that the first protruding part of the conducting block is contained in the first hollow-out groove; and the first laminated plate, the prepreg layer and the second laminated plate are subjected to lamination, and the circuit board for bearing the large current is obtained. The invention further provides the corresponding circuit board for bearing the large current. The conducting block is embedded into the prepreg layer of the circuit board, the protruding part of the conducting block is exposed out of the first laminated plate of the circuit board for bearing the large current, circuit connecting of the conducting block is simplified, and the problem that an electronic product is hard to assemble, and miniaturization is difficult is solved.