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发明公开
CN103681645A 具有增强安全性的三维半导体封装器件 无效 - 撤回

具有增强安全性的三维半导体封装器件
摘要：
本申请公开了一种半导体封装器件，其包括具有存储电路的集成电路器件封装体。在一实施方式中，半导体封装器件包括具有第一表面和第二表面的半导体基底。所述半导体基底包括一个或多个集成电路，所述集成电路接近第一表面（例如与第一表面相邻、在第一表面中或上）形成。半导体封装器件还包括设置在第二表面之上的集成电路器件，该集成电路器件包括用于存储敏感数据的存储电路。在一个或多个实施方式中，半导体封装器件包括贯穿基底通路，所述贯穿基底通路提供至集成电路封装体的电连接。半导体封装器件还包括了装封结构，所述装封结构在第二表面上设置并且至少大体上装封集成电路器件封装体。
摘要（英）：

The invention discloses a semiconductor package device. The semiconductor package device that includes an integrated circuit device package having a storage circuitry is disclosed. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to (e.g., adjacent to, in, or on) the first surface. The semiconductor package device also includes an integrated circuit device disposed over the second surface, the integrated circuit device including storage circuitry for storing sensitive data. In one or more implementations, the semiconductor package device includes a through-substrate via that furnishes an electrical connection to the integrated circuit package. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the integrated circuit device package.

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