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发明授权
CN103681576B 具有无源能量元件的半导体封装器件 有权

具有无源能量元件的半导体封装器件
摘要：
本申请公开了一种半导体封装器件，所述半导体封装器件包括在其中集成的无源能量元件。在一实施例中，半导体封装器件包括具有第一表面和第二表面的半导体基底。所述半导体基底包括一个或多个集成电路，所述集成电路接近第一表面形成。半导体封装器件还包括设置在第二表面之上的无源能量元件。无源能量元件与所述一个或多个集成电路电连接。半导体封装器件还包括了装封结构，其在第二表面上设置并且至少大体上装封所述无源能量元件。
摘要（英）：

A semiconductor package device is disclosed that includes a passive energy component integrated therein. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to the first surface. The semiconductor package device also includes a passive energy component positioned over the second surface. The passive energy component is electrically connected to one or more integrated circuits. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the passive energy component.

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