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发明公开
CN103346095A 引线框架制造方法 有权

引线框架制造方法
摘要：
本发明提供一种引线框架制造方法，包括：形成引线框架本体，引线框架本体包括多个芯片承载基座和连接部，多个芯片承载基座之间通过连接部连接；对所述连接部进行半刻蚀；在连接部的半刻蚀区域形成塑封层；一方面能有效地保证引线框架的强度，另一方面采用刀片切割连接部时，有效减少刀片与金属的摩擦，进一步地有效减少毛刺的产生，提高封装产品的品质。
摘要（英）：

The invention provides a lead frame manufacturing method. The lead frame manufacturing method comprises the steps that a lead frame body is formed, wherein the lead frame body comprises a plurality of chip bearing substrates and a connecting portion, and the chip bearing substrates are connected through the connecting portion; half etching is conducted on the connecting portion; a plastic package layer is formed in a half etching area of the connecting portion. On one hand, the intensity of a lead frame can be ensured effectively, and on the other hand, when a blade is adopted to cut the connecting portion, friction between the blade and metal is reduced effectively, occurrence of burrs is further reduced effectively, and the quality of package products is improved.

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