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发明公开
CN103329264A 带有复数个具有分段式贯通硅通路的堆叠有源芯片的微电子组件 有权

带有复数个具有分段式贯通硅通路的堆叠有源芯片的微电子组件
摘要：
提供了微电子组件(100)，其中分别在第一微电子元件(110)和第二微电子元件(102)的正面暴露的第一导电垫(108)与第二导电垫(106)并置，每个微电子元件都包含有源半导体器件。导电元件(114)可在第一开口(111)、第二开口(113)和第三开口(180)内延伸，第一开口(111)从第一微电子元件(110)的背面(118)朝着其正面(103)延伸，第二开口(113)从第一开口(111)朝着第一微电子元件(110)的正面(103)延伸，第三开口(180)穿过第一垫(108)和第二垫(106)中至少一个而延伸，以与第一垫及第二垫接触。第一开口(111)和第二开口(113)的内表面(121、123)可相对于第一微电子元件(110)的正面(103)分别沿第一方向和第二方向延伸，以限定明显的角度。
摘要（英）：

A microelectronic assembly (100) is provided in which first and second electrically conductive pads (108, 106) exposed at front surfaces of first and second microelectronic elements (110, 102) respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element (114) may extend within a first opening (111) extending from a rear surface (118) of the first microelectronic element (110) towards the front surface (103) thereof, within a second opening (113) extending from the first opening (111) towards the front surface (103) of the first microelectronic element (110), and within a third opening (180) extending through at least one of the first and second pads (108, 106) to contact the first and second pads. Interior surfaces (121, 123) of the first and second openings (111, 113) may extend in first and second directions relative to the front surface (103) of the first microelectronic element (110) respectively, to define a substantial angle.

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