知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN103283019A 半导体装置 无效 - 撤回

半导体装置
摘要：
半导体装置包括第一扩张型半导体芯片(31)和第二半导体芯片(5)，该第一扩张型半导体芯片(31)具有第一半导体芯片(6a)和从该第一半导体芯片(6a)的侧面朝向外侧扩张地设置的扩张部(1a)，该第二半导体芯片(5)安装在第一扩张型半导体芯片(31)上，并与第一半导体芯片(6a)电连接。第一扩张型半导体芯片(31)具有设置在扩张部(1a)上且与第一半导体芯片(6a)的电极电连接的第一扩张部电极焊盘(21a)。
摘要（英）：

A semiconductor device is provided with: a first expanded semiconductor chip (31) which comprises a first semiconductor chip (6a) and an expanded part (1a) that is provided so as to expand outwardly from a lateral surface of the first semiconductor chip (6a); and a second semiconductor chip (5) which is mounted on the first expanded semiconductor chip (31) and electrically connected to the first semiconductor chip (6a). The first expanded semiconductor chip (31) comprises a first expanded part electrode pad (21a) that is provided on the expanded part (1a) and electrically connected to an electrode of the first semiconductor chip (6a).

公开/授权文献
0/0