The invention relates to a semiconductor packager which comprises a lead frame, chips, a plurality of electric conduction lugs and packaging colloid bodies. The lead frame comprises a plurality of inner pins and a plurality of outer pins; the inner pins are provided with a plurality of first connecting pads; the outer pins are provided with a plurality of second connecting pads; and the center of at least one second connecting pad deviates from the center of the corresponding first connecting pad. The chips are arranged on the inner pins. The electric conduction lugs are electrically connected with the chips and the first connecting pads. The packaging colloid bodies wrap the inner pins, the chips and the electric conduction lugs.