A semiconductor structure includes a substrate unit, a semiconductor element, a conductive pin, a package and an electromagnetic interference resisting film. The substrate unit has a grounded end, an upper surface and a lower surface. The semiconductor element and the conductive pin are arranged on the upper surface of an adjacent substrate unit. The package covers the semiconductor element and has a first package upper surface, a second package upper surface and a package side surface. The first package upper surface is substantially parallel to the second package upper surface. The package side surface is linked to the first package upper surface and the second package upper surface. The electromagnetic interference resisting film includes an upper part, a side part and a supporting part. The upper part covers the first package upper surface; the supporting part covers the second package upper surface of the package and the side part covers the package side surface of the package. The conductive pin connects the grounded end of the substrate unit and the side part of the electromagnetic interference resisting film.