The invention relates to an encapsulation method of a light emitting diode (LED) comprising the following steps: fixing an LED chip in a reflection cup; arranging two electric conductive pieces on two electrodes of the LED chip and enabling the two electric conductive pieces to protrude the reflection cup; filling translucidus materials in the reflection cup to seal the LED chip; solidifying the translucidus materials; grinding the surfaces of the translucidus materials and enabling the electric conductive pieces to be exposed on the surfaces of the translucidus materials; and forming two electric conductive layers, respectively connecting each electric conductive pieces and extending out of the reflection cup so as to be electronically connected with an external electrode. Compared with the prior art, the inventive encapsulation method of the LED not only saves processing time, increases production efficiency, but also reduces the size of an encapsulation structure.