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发明授权
CN102110756B 白光LED及其封装方法 失效 - 权利终止 诉讼

白光LED及其封装方法
摘要：
本发明涉及一种白光LED及其封装方法，所述白光LED，包括：基座、固定于基座上的LED芯片，所述LED芯片上设有硅胶层，所述硅胶层上覆盖有与其紧密贴合的玻璃层，所述玻璃层上镀设有具有高热导率的导热薄膜。所述白光LED的封装方法，包括下述步骤：将LED芯片固晶在基座上；在LED芯片上设置硅胶层；在玻璃的一表面镀设具有高导热率的导热薄膜；将所述镀有导热薄膜的玻璃覆盖在硅胶层上，使其与硅胶层紧密贴合，然后移至烘箱中，进行预固化和固化，制得所述白光LED。本发明通过在封装时于硅胶层的外表面设置玻璃层，并于玻璃层上镀设一层高热导率的导热薄膜，能够提高硅胶层对空气的散热速度，提高LED的使用寿命。
摘要（英）：

The invention relates to a white light LED (light-emitting diode) and a packaging method thereof. The white light LED comprises a base and an LED chip fixed on the base, wherein a silicone layer is arranged on the LED chip, the silicone layer is covered by a glass layer and is tightly close to the glass layer, and a heat-conduction thin-film with high heat conductivity is plated on the glass layer. The packaging method of the white light LED comprises the following steps: fixing the LED chip on the base; arranging the silicone layer on the LED chip; plating the heat-conduction thin-film with high heat conductivity on one surface of the glass layer; and covering the silicone layer with the glass layer plated with the heat-conduction thin-film to enable the glass layer to be tightly close to the silicone layer, transferring into an oven, and performing precuring curing. According to the invention, during packaging, the glass layer is arranged on the outer surface of the silicone layer, and the heat-conduction thin-film with high heat conductivity is plated on the glass layer, so that the heat dissipation speed of the silicone layer in the air is increased, and the service life of the LED is prolonged.

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