The invention relates to a double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly. The method comprises the following process steps: a metal substrate is selected; a metal layer is electroplated and covered on the front of the metal substrate; the back of the metal substrate is etched; packless plastic packaging material (epoxy resin) is packaged on the back of the metal substrate; various graphics are etched on the front of the metal substrate, the front of each pin is etched to ensure that the back of each pin is smaller than the front of each pin and the pin structure is big end up; chips are arranged; filled plastic packaging material (epoxy resin) is packaged on the front of the semifinished product; a metal layer is electroplated and covered on the back of each pin; and the chips which are connected in an array aggregate mode are separately one by one to prepare the finished product with the double-sided graphics chip flip-chipmodule packaging structure. The pins of the chip packaging structure prepared by the method of the invention can not fall.