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发明授权
CN101877938B 薄板印制电路板加工方法及薄板印制电路板 有权 转让

薄板印制电路板加工方法及薄板印制电路板
摘要：
本发明实施例涉及一种薄板印制电路板加工方法，所述薄板印制电路板包括具有相邻的第一板面及第二板面的介质夹层，所述第一板面设有第一无图形区域，所述第二板面设有第二无图形区域，所述方法包括在所述第一无图形区域铺设一组第一铜条；在所述第二无图形区域铺设与所述第一铜条在长度方向上相互垂直的一组第二铜条。本发明实施例还提供了一种薄板印制电路板。采用本发明实施例的薄板印制电路板加工方法及薄板印制电路板，可抵消薄板印制电路板的介质夹层在经向和纬向上所产生的应力，解决了薄板印制电路板的翘曲问题，大大降低了因为该翘曲问题所导致的薄板印制电路板的报废率。
摘要（英）：

The embodiment of the invention relates to a manufacturing method of a sheet printed circuit board. The sheet printed circuit board comprises a medium interlayer provided with a first board surface and a second board surface which are adjacent to each other, wherein the first board surface is provided with a first non-graphic region, and the second board surface is provided with a second non-graphic region. The manufacturing method of the sheet printed circuit board comprises the following steps of: laying a group of first copper strips in the first non-graphic region, and laying a group of second copper strips vertical to the first copper strips in the length direction in the second non-graphic region. The embodiment of the invention also provides the sheet printed circuit board. By adopting the manufacturing method of the sheet printed circuit board and the sheet printed circuit board in the embodiment of the invention, stress generated by the medium interlayer of the sheet printed circuit board in the warp direction and the weft direction can be counteracted, the warping problem of the sheet printed circuit is solved, and the rejection rate of the sheet printed circuit board caused by the warping problem is greatly reduced.

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