The invention discloses a profile modelling electroplating method for continuous casting crystallizer copper plate non-uniform thickness coating. Firstly total area electroplating is carried out on the copper plate, when the upper area thinner coating of the copper plate meets the product size requirement, the copper plate is hoisted at certain velocity by utilizing PLC system to control a hoisting device connected with a serve electrode, so that relative displacement is generated between the copper plate and plating solution level, the level moves toward the lower edge of the copper plate, the coating meeting the size requirement is separated with the plating solution, electroplating is stopped, electroplating is only carried out on the lower thick coating area of the copper plate, and coating thickness is increased according to the requirement. When the copper plate is hoisted, electroplating current is according adjusted by the PLC control system according to the electroplating process requirement. The invention can realize that crystallizer copper plate coating is non-uniform in thickness and the thickness is gradually increased from top to bottom along the width direction, thus consumption of electroplating material and electric energy is obviously reduced compared with the original electroplating method.