The invention discloses a selective plating device comprising a plating solution groove provided with an anode therein. The invention is characterized in that the device further comprises a hook supporting frame and more than two sets of hooks which are arranged on the hook supporting frame and are arranged along a direction parallel with liquid surface of the plating solution. The invention has beneficial effects as follows: the device is conveniently used; solid impurities can be reduced during a plating solution adding process; the plating solution overflowing can automatically flow into areservoir to be recycled; a lead frame can be partially plated, so material is saved by over 25%; post treatment process is eliminated; and the device is simply operated, simply structured and easilymanufactured.