The invention provides a method for examining whether a hot plate used for baking a wafer is inclined or not. The method comprises the following steps: (1), providing substratum provided with a silicon nitride layer; (2), applying a light-blocking layer to the silicon nitride layer; (3), exposing the wafer to light, and patterning the wafer; (4), dividing the surface of the wafer into different areas, and measuring key line-widths of each area; (5), verifying that the hot plate is inclined if the difference between the maximum key line-width and minimum key line-width among the key line-widths is up to the predetermined value. Compared with the prior art, the invention has the advantages of simple operation, accurate measurement, and ability to reflect the inclined trend of the hot plate in a comparatively swift fashion, thereby rendering detection of the slope of the hot plate simple and rapid.