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发明授权
CN101256995B 半导体封装体及硅基封装基板 失效 - 权利终止

半导体封装体及硅基封装基板
摘要：
本发明提供一种半导体封装体及硅基封装基板，上述半导体封装体包括：硅基封装基板，其厚度小于200μm；半导体芯片，包括至少一个低介电常数介电层，其低介电常数小于3.0；以及多个焊料凸块，设置于该半导体芯片与该硅基封装基板之间。本发明能够减少低介电常数材料层的的脱层及龟裂，可使用无铅焊料凸块及高铅焊料凸块，并减少串扰的问题。
摘要（英）：

A silicon-based thin package substrate is used for packaging semiconductor chips. which includes a silicon-based thin package substrate having a thickness of less than about 200 mu m; a low dielectric constant dielectric layer with the dielectric constant smaller than 3.0; a plurality of solder cams arranged between the semiconductor chip and the silicon-based thin package substrate. The invention reduces the delamination and chap of the low dielectric constant dielectric material layer, uses the lead-free solder cam and the high-lead solder cam, and reduces the crosstalk.

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