LOW PROFILE ACOUSTIC MODULE
    1.
    发明公开

    公开(公告)号:US20240365039A1

    公开(公告)日:2024-10-31

    申请号:US18139877

    申请日:2023-04-26

    IPC分类号: H04R1/10

    CPC分类号: H04R1/1008 H04R1/1058

    摘要: A low profile acoustic module is described. Embodiments include a headset acoustic module having first and second chambers. The first chamber has a side wall and first portion of a back wall, and defining a first volume. The side wall defines an opening sized to retain a speaker, and the first chamber defines a first volume. The second chamber is adjacent the first chamber, and comprises an inner wall, a front wall, and a second portion of the back wall, and defining a second volume greater than the first volume. The second volume is fluidly coupled to the first volume via a first set of vents on the inner wall, the second volume is fluidly coupled to an ambient atmosphere via a second set of vents, and the inner wall comprises at least a portion of the side wall.

    Headphone sealing cup
    3.
    发明授权

    公开(公告)号:US12133044B2

    公开(公告)日:2024-10-29

    申请号:US18307029

    申请日:2023-04-26

    申请人: EPOS Group A/S

    IPC分类号: H04R1/10

    CPC分类号: H04R1/1083 H04R1/1008

    摘要: An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.

    OPERATION CONTROL METHOD OF HEADSET, RING HEADSET AND STORAGE MEDIUM

    公开(公告)号:US20240357278A1

    公开(公告)日:2024-10-24

    申请号:US18757838

    申请日:2024-06-28

    申请人: GOERTEK INC.

    IPC分类号: H04R1/10 H04R3/00

    摘要: Disclosed are an operation control method of a headset, an operation control device of a headset, a ring headset, and a computer-readable storage medium. The method is applied to applied to a ring headset, and includes: in response to detecting that a user is wearing the ring headset, determining a wearing position where the user wears the ring headset; in response to determining that the wearing position is a user's finger, controlling the ring headset to operate a first working mode; or in response to determining that the wearing position is a user's ear, controlling the ring headset to operate a second working mode.

    Wireless Earbud Charging
    8.
    发明公开

    公开(公告)号:US20240348962A1

    公开(公告)日:2024-10-17

    申请号:US18441760

    申请日:2024-02-14

    申请人: Sonos, Inc.

    发明人: Hilmar Lehnert

    摘要: Examples described herein relate to a charging system for wireless earbuds involving charging adapters that are attachable to the wireless earbuds. In some implementations, the charging adapter is attachable to an external surface of an earbud using a magnetic or mechanical interface that align electrodes of the charging adapter with electrodes on the wireless headset, allowing an internal battery of the earbud to draw current and charge from the charging adapter while the earbud is in-ear. Then, when the internal battery is and recharged using a charging case or wall charger, the charging adapter can be detached from the earbud.