WIRELESS AUDIO SYSTEMS
    1.
    发明公开

    公开(公告)号:US20240196120A1

    公开(公告)日:2024-06-13

    申请号:US18587479

    申请日:2024-02-26

    申请人: Apple Inc.

    IPC分类号: H04R1/00

    CPC分类号: H04R1/00 H04R2420/07

    摘要: A loudspeaker system can have first and second loudspeakers selectively operable in a single-channel mode or in a multi-channel mode. In the single-channel mode, the first and the second loudspeakers are configured to simultaneously reproduce a substantially identical signal. In the multi-channel mode, the first loudspeaker reproduces a first-channel signal and the second loudspeaker reproduces a second-channel signal. The first-channel signal and the second-channel signal can constitute respective portions of a multi-channel signal. Such loudspeaker systems can also have a mode selector configured to select one of the single-channel mode and the multi-channel mode. In some embodiments, such selection can occur in response to one or more detected proximities of another loudspeaker system. Multi-zone loudspeaker systems are also disclosed.

    System and method for Bluetooth® cloning and switching system among plural paired input/output devices

    公开(公告)号:US11985458B2

    公开(公告)日:2024-05-14

    申请号:US17733268

    申请日:2022-04-29

    申请人: Dell Products, LP

    IPC分类号: H04R1/00 H04W4/80 H04W84/18

    摘要: A first wireless speaker and microphone device paired with an information handling system comprising a microphone, speaker, wireless radio system for conducting a first pairing with the information handling system for wireless communications, and memory for storing a pairing profile for the first pairing. A microcontroller to operatively couple the first wireless speaker and microphone device to a second wireless speaker and microphone device by conducting a second pairing between the first and second wireless speaker and microphone devices, and cloning and transmitting the pairing profile from the first pairing to the second wireless speaker and microphone device. The first wireless speaker and microphone device to receive a switching command to stop audio transmission and reception at the first wireless speaker and microphone device to allow transmission and reception at the second wireless speaker and microphone device using a cloned wireless link established with the cloned pairing profile.

    Haptic stimulation systems and methods

    公开(公告)号:US11975359B2

    公开(公告)日:2024-05-07

    申请号:US17511281

    申请日:2021-10-26

    发明人: Jun Xu Fei Liu

    IPC分类号: B06B1/02 H04R1/00

    CPC分类号: B06B1/0284 H04R1/00

    摘要: The disclosure relates to technology for haptic stimulation. A haptic stimulation device comprises a set of haptic stimulation elements. Each haptic stimulation element comprises a transducer configured to generate a pressure wave and an enclosure coupled to the transducer thereby forming a cavity bounded by the enclosure and the transducer. The haptic stimulation device comprises a controller configured to drive the transducers to generate a haptic stimulation pattern based on pressure waves in the cavities.

    Wireless audio systems
    4.
    发明授权

    公开(公告)号:US11943575B2

    公开(公告)日:2024-03-26

    申请号:US17238192

    申请日:2021-04-22

    申请人: Apple Inc.

    IPC分类号: H04R1/00

    CPC分类号: H04R1/00 H04R2420/07

    摘要: A loudspeaker system can have first and second loudspeakers selectively operable in a single-channel mode or in a multi-channel mode. In the single-channel mode, the first and the second loudspeakers are configured to simultaneously reproduce a substantially identical signal. In the multi-channel mode, the first loudspeaker reproduces a first-channel signal and the second loudspeaker reproduces a second-channel signal. The first-channel signal and the second-channel signal can constitute respective portions of a multi-channel signal. Such loudspeaker systems can also have a mode selector configured to select one of the single-channel mode and the multi-channel mode. In some embodiments, such selection can occur in response to one or more detected proximities of another loudspeaker system. Multi-zone loudspeaker systems are also disclosed.

    Piezoelectric mems microphone chip and piezoelectric mems microphone

    公开(公告)号:US11805371B1

    公开(公告)日:2023-10-31

    申请号:US18201174

    申请日:2023-05-23

    摘要: The present application discloses a piezoelectric micro electrical mechanical system (MEMS) microphone chip and a piezoelectric MEMS microphone, and relates to the technical field of piezoelectric devices. The piezoelectric MEMS microphone chip includes at least one substrate frame and at least one plurality of sound receiving beams arranged on the substrate frame. Each of the sound receiving beams includes a connecting beam and a cantilever beam. The connecting beam and the cantilever beam are staggered on a circumference. One ends of the plurality of sound receiving beams that face a geometric center of the a circumference are fixedly connected to one another in a center defined by the substrate frame, and one end of the connecting beam that is away from the geometric center is fixedly connected to the substrate frame.

    Microphone assembly with free fall detection

    公开(公告)号:US11743642B2

    公开(公告)日:2023-08-29

    申请号:US17602916

    申请日:2020-04-03

    发明人: John Albers

    CPC分类号: H04R3/007 H04R1/08

    摘要: A microphone assembly includes an acoustic transducer configured to generate an analog signal in response to pressure changes sensed by the acoustic transducer. The analog signal includes frequency components below a threshold frequency. The microphone assembly also includes an integrated circuit electrically coupled to the acoustic transducer and configured to determine a characteristic of frequency components below the threshold frequency, determine whether the characteristic of the frequency components corresponds to a fall event, and generate an output signal in response to a determination that the characteristic of the frequency components corresponds to the fall event. The microphone assembly also includes a housing having an external device interface with electrical contacts. The acoustic transducer and the integrated circuit are disposed within the housing. The integrated circuit is electrically coupled to contacts of the external device interface.