-
公开(公告)号:US11773298B2
公开(公告)日:2023-10-03
申请号:US14625162
申请日:2015-02-18
发明人: Metin Sitti , Michael Murphy , Burak Aksak
CPC分类号: C09J7/00 , B29C33/3857 , B81C1/00031 , B82Y10/00 , B82Y40/00 , G03F7/0002 , B29L2031/757 , C09J2301/31 , C09J2301/416 , Y10T428/24479
摘要: Dry adhesives and methods for forming dry adhesives. A method of forming a dry adhesive structure on a backing material, comprises: forming a template backing layer of energy sensitive material on the backing material; forming a template layer of energy sensitive material on the template backing layer; exposing the template layer to a predetermined pattern of energy; removing a portion of the template layer related to the predetermined pattern of energy, and leaving a template structure formed from energy sensitive material and connected to the substrate via the template backing layer.
-
公开(公告)号:US20230151247A1
公开(公告)日:2023-05-18
申请号:US17916825
申请日:2021-04-07
申请人: INNOCISE GmbH
发明人: Karsten Moh , Lena Barnefske , Eduard Arzt , Fabian Rundel
IPC分类号: C09J7/00
CPC分类号: C09J7/00 , C09J2301/31
摘要: A moulded body comprising includes a structured surface, wherein the surface has a structuring including a plurality of protrusions (pillars), at least each having a stem and comprising an end face pointing away from the surface. With this end face, the protrusions come into contact with the surface of the adhered object, wherein at least one protrusion comprises at least one structural feature, which, when loading the protrusion, leads to a directed deformation of the protrusion by changing the adhesion.
-
公开(公告)号:US11541607B2
公开(公告)日:2023-01-03
申请号:US16345166
申请日:2017-10-18
申请人: LINTEC CORPORATION
发明人: Masakazu Ishikawa
IPC分类号: B29C65/04 , B29C65/42 , B29C65/50 , C08K3/22 , C09J11/04 , C09J123/26 , C09J129/14 , C09J131/04 , C09J167/00 , C09J177/00 , H05B6/46 , B29C65/40 , C09J123/00 , C09J125/04 , H05B6/64 , C09J7/00 , C09J201/00 , C09J123/10 , C09J7/35 , C09J5/06 , C09J9/00 , H01B3/44 , H01B17/56 , H05B6/50 , C08K3/14
摘要: A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.
-
公开(公告)号:US20220411664A1
公开(公告)日:2022-12-29
申请号:US17895334
申请日:2022-08-25
发明人: Metin Sitti , Michael Murphy , Burak Aksak
摘要: Dry adhesives and methods for forming dry adhesives. A method of forming a dry adhesive structure on a backing material, comprises: forming a template backing layer of energy sensitive material on the backing material; forming a template layer of energy sensitive material on the template backing layer; exposing the template layer to a predetermined pattern of energy; removing a portion of the template layer related to the predetermined pattern of energy, and leaving a template structure formed from energy sensitive material and connected to the substrate via the template backing layer.
-
公开(公告)号:US20220363958A1
公开(公告)日:2022-11-17
申请号:US17878093
申请日:2022-08-01
IPC分类号: C09J9/02 , C09J201/00 , C09J163/00 , C09J7/00 , C09J175/16
摘要: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.
-
公开(公告)号:US20220340780A1
公开(公告)日:2022-10-27
申请号:US17300557
申请日:2021-08-16
申请人: Robert Alan Bard
发明人: Robert Alan Bard
摘要: A system and method is described for marking materials in rolled form so as to overcome the problem of locating the starting point/location of said rolled material after a portion of said rolled material has been removed from the roll of said rolled material by distinguishing/pinpointing the location of every actual tear. The system and method overcomes personal frustration, wasted material and wasted time.
-
公开(公告)号:US11453803B2
公开(公告)日:2022-09-27
申请号:US15936644
申请日:2018-03-27
申请人: LG Chem, Ltd.
发明人: Min-Seok Song , Chan-Oh Yoon , Eun-Kyung Park , Bu-Gi Jung , Jang-Soon Kim
IPC分类号: C09J7/00 , G02B1/04 , C09J7/10 , C09J133/08 , C09J163/00 , C09J175/14
摘要: Disclosed is a semi-hardened pressure sensitive adhesive film to be used in the semi-hardened state and having excellent printing step absorption properties. The adhesive film according to the present invention contains a radial polymer composition and a cationic polymer composition, and the radial polymer composition is primarily cross-linked to maintain the semi-hardened state. When applied onto a substrate through a printing step, the present invention has excellent step absorption properties and adhesion properties and excellent durability even under high-temperature and high-humidity conditions.
-
公开(公告)号:US20220266573A1
公开(公告)日:2022-08-25
申请号:US17742782
申请日:2022-05-12
申请人: SKC Co., Ltd.
发明人: Hyejin KIM , Haksoo LEE , Sungjin CHUNG
摘要: A film for laminating including an embossed surface, wherein the embossed surface includes a plurality of convex parts and a plurality of concave parts disposed between the plurality of convex parts, wherein each of the plurality of convex parts is surrounded by the plurality of concave parts and does not include a convex part, wherein each of the plurality of convex parts has an average area of 4.0 mm2 or less, wherein an absolute value of Skewness (Ssk) of the embossed surface is more than 0, and 1 or less, and wherein Ar of the embossed surface is 1.001 to 2, where Ar is calculated by the following Formula 1: Ar = As Ac [ Formula 1 ] where, in the Formula 1, As is an average surface area of surface profiles of the plurality of convex parts comprised in a unit area (1 cm2) of the embossed surface and Ac is an average area occupied by the plurality of convex parts comprised in a unit area (1 cm2) of the embossed surface, is disclosed.
-
公开(公告)号:US11421065B2
公开(公告)日:2022-08-23
申请号:US16423929
申请日:2019-05-28
发明人: Eri Masuda , Junichi Nakamura , Kazuyoshi Odaka , Hiroko Shinada
IPC分类号: C08F265/06 , C08F265/04 , C09J133/14 , C09J133/26 , C08F290/04 , C09J7/00 , C09J133/04 , C08F220/18
摘要: Provided are an adhesive resin composition capable of forming an adhesive layer excellent in holding force, wet heat clouding resistance, and low corrosiveness; and an adhesive sheet. The adhesive resin composition includes a (meth)acrylic copolymer (A) having a constituent unit derived from a macromonomer (a) and a constituent unit derived from a vinyl monomer (b), in which the (meth)acrylic copolymer (A) has at least one of an amide bond and a radical polymerizable group.
-
公开(公告)号:US20220186093A1
公开(公告)日:2022-06-16
申请号:US17684126
申请日:2022-03-01
发明人: Ryoko ASAI , Kayo SHIMOKAWA , Kensuke TANI , Yoshiko KIRA , Kenichi OKADA
IPC分类号: C09J153/02 , C09J7/32 , C09J11/06 , C09J7/20 , C09J7/00 , C09J11/08 , C09J201/00 , C09J133/00 , C09J121/00 , C08G18/76 , C09J123/22 , C09J133/10 , C09J135/00
摘要: The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
-
-
-
-
-
-
-
-
-